NAVI Titanium porous media filters are developed to meet rigorous particulate control requirements in precision wafer manufacturing environments. Micro-contaminants, dissolved impurities, and pipeline residues can reduce wafer yield and affect sensitive production equipment. Unlike single-use non-metallic filter cores, sintered metal substrates offer better resistance to corrosive liquids, elevated operating temperatures, and repeated regeneration. With evenly distributed, fixed pores, reliable cyclic performance, and low metal ion leaching, NAVI Titanium porous media filters are well suited to continuous ultra-clean manufacturing and demanding semiconductor processing applications.
Solution of NAVI Titanium
These porous metal filter media are widely deployed in industries with zero-tolerance for tiny pollutants, mainly semiconductor chip manufacturing, high-purity fine chemical processing, clean energy equipment and pharmaceutical purification. Different production lines carry distinct filtration challenges in terms of medium corrosivity and cleanliness standards, while our sintered metal media offer flexible matching schemes for reactive fluorine gas, strong acid electronic chemicals and ultra-high vacuum working scenes.
NAVI Titanium delivers one-stop customized porous metal filtration solutions exclusive to front-end and back-end processes. We adjust raw material selection, pore precision, overall dimensions and surface treatment schemes according to clients' actual working conditions, including fluid corrosiveness, operating temperature, pressure limits and equipment layout. Our products fill the performance gap of ordinary filter media under harsh high-purity working environments, maintaining purification effect.
Application
Semiconductor manufacturing is among the industries with the strictest requirements for fluid cleanliness and contamination control. As advanced fabrication technologies continue to evolve, production processes require precise management of foreign substances that may affect equipment operation, process stability, and product consistency. In these highly controlled manufacturing environments, NAVI Titanium porous media filters play an essential role in maintaining the quality of process gases and chemical fluids. Porous media filtration solutions are integrated into critical process stages to reduce contamination risks, improve fluid management, and support the stringent cleanliness standards required for advanced semiconductor production.
Advanced wafer fabrication relies on impurity-free process gas supply to guarantee consistent etching and thin-film deposition results. Core processes including dry etching, PECVD and ALD adopt reactive fluorine gases such as F₂, WF₆ and SF₆, which require full interception of micro particles generated during gas storage, pipeline transmission and valve switching. Installed inside point-of-use terminals, MFC front protection sections and VMB valve manifold boxes, our porous filter media trap pipeline debris and residual reaction particles before gas enters precision process chambers. The compact structural design keeps reliable gas flow rate while achieving ultra-fine particle removal, effectively unifying etching uniformity and improving thin-film deposition consistency for next-gen semiconductor production equipment.
Corrosive Electronic Chemical Circulation Purification for Wet Process
Wafer front-end processes like surface cleaning, gate etching and passivation layer stripping demand ultra-clean acid solutions. Common fluorine-containing corrosive liquids including hydrofluoric acid (HF) and BOE buffered etching agent will generate suspended particles and reaction residues after repeated circulation, which scratch wafer surfaces and lower finished product yield. Our titanium porous filter media are installed inside electronic chemical circulation loops to continuously remove micro impurities accumulated during cyclic production. With outstanding chemical inertness and minimal metal ion leaching, titanium media avoid secondary pollution of high-purity acids, protect precision wet process equipment and sustain stable wafer surface treatment quality in mass production.
Thin-film deposition, ion implantation and vacuum etching all operate under ultra-high vacuum environments; tiny particles falling into process chambers will form fatal wafer defects. The porous media are mounted inside vacuum gas delivery pipelines to block particle transfer from gas sources and equipment inner walls into reaction chambers. With low outgassing performance and stable particle interception capability under high temperature & vacuum conditions, these filter media reduce chamber pollution risks, ensure repeatable processing parameters and extend the service life of high-value vacuum semiconductor equipment. High-purity hydrogen, oxygen and doping gas used in chip manufacturing are transported through high-pressure pipeline systems; tiny rust particles and joint debris inside pipelines easily pollute downstream process equipment. The metal filter media work as front-end purification barriers for pressurized gas supply systems, intercepting foreign contaminants and maintaining gas purity standard for wafer fabrication. Customized to withstand long-term high-pressure working status, these filter media eliminate impurity fluctuations during continuous production, lower equipment failure probability and realize safer, more stable specialty gas delivery for semiconductor fabs.
High-End Electronic Chemical Refining With Special Alloy Porous Media
Semiconductor-grade acid production (hydrochloric acid, sulfuric acid, nitric acid and mixed corrosive acids) requires strict full-process impurity control. Trace suspended solids in raw acid will cause mass yield loss in subsequent wafer processing. We supply nickel alloy porous media for severe strong acid refining environments; different alloy materials are selected based on acid composition and oxidation intensity to realize continuous online purification of high-value electronic chemicals. The filter media stabilize fluid cleanliness in circulation pipelines, cut impurity fluctuation risks and fully meet the ultra-high purity requirements of semiconductor chemical production.
Purchasing guide
Quality control (QC)
Specialty Alloy Medium for High-End Wet Electronic Chemical Refining
Ultra-high purity chemical preparation for semiconductor wet manufacturing demands rigorous full-cycle impurity control during refining, circulating and fluid delivery. Common aggressive acidic media such as hydrochloric acid, sulfuric acid, nitric acid and compound mixed acid solutions are highly sensitive to microscale suspended contaminants and residual sediments. Even minimal foreign impurities can deteriorate wafer surface quality and reduce overall production yield. Our customized alloy porous media filters are engineered specifically for severe corrosive chemical environments. By matching different alloy grades according to fluid composition, oxidation activity and actual operating parameters, we achieve perfect chemical compatibility with high-purity electronic grade solutions. This targeted filtration design effectively stabilizes fluid cleanliness in circulating loops, eliminates cumulative contamination risks, and ensures consistent purification standards for high-end semiconductor chemical manufacturing.
In continuous wet-process mass production, repeated fluid circulation tends to accumulate fine suspended particles, reaction by-products and trace residual pollutants. Without precise real-time purification, these tiny contaminants gradually build up and interfere with process stability, leading to inconsistent etching and cleaning results. NAVI Titanium advanced metal filtration media support long-term continuous online purification for wet chemical systems. They sustain stable fluid quality throughout repeated production cycles, suppress impurity accumulation and reduce process fluctuations. For high-volume semiconductor wet fabrication scenarios requiring ultra-stable chemical purity and uninterrupted operation, our alloy solutions deliver reliable contamination control and superior process continuity.
Protective Packaging
NAVI Titanium treats packaging as part of the final delivery process, with the packing method selected according to product size, quantity, transportation distance, and shipping method. Suitable cartons, reinforced cases, protective materials, and internal fixing methods can be combined to reduce movement and impact during handling and transportation. For export orders, products are securely arranged before shipment to help maintain their condition during loading, unloading, long-distance transportation, and warehouse handling. Larger or heavier components can be individually secured, while smaller parts are grouped and separated to simplify counting and receiving. Each shipment can be organized with clear information covering product model, specification, quantity, material, and batch details. Relevant packing and product documents can be provided according to the order requirements, helping customers complete receiving, inventory registration, and incoming inspection more efficiently.
Before dispatch, the finished goods are checked against the order information to verify quantity, specifications, identification, and overall packing condition. This provides a clearer handover from final production to transportation and helps reduce receiving errors at the customer's facility.
Key Packaging Advantages
- Export-oriented packaging for international transportation
- Internal fixing to reduce movement and impact
- Separate packing for different specifications when required
- Clear product and batch identification
- Pre-shipment quantity and specification verification
- Packing documentation available for customer reference
FAQ
01. What filtration accuracy can porous media filters achieve?
02. How long can porous media filters be used?
03. Are porous media filters suitable for corrosive environments?
04. Can the filters be cleaned and reused?
05. How does the structure affect filtration performance?
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